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What the posting requires

Required
  • IC package substrate
  • Substrate design
  • Layout design rules
  • Fab file
  • DFM
  • DFA
  • Signal integrity
  • Power integrity
  • Thermal
Preferred
  • Cadence Integrity 3DIC
  • Expedition Package Designer
  • SKILL
  • Floorplan
  • Codesign
  • Pads Layout

These tags are our reading of the posting. They can miss something; the original posting is the reference.

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