About the role
The team designs complex integrated circuit substrate packages for high-power and high-speed applications. The engineer in this role performs end-to-end layout design, collaborating with other engineering disciplines to optimize power delivery and signal integrity for advanced packaging solutions.
Our summary of the posting; the original is on the Etched careers page.
What the posting requires
- Required
- High-speed signaling design
- Allegro Package Designer
- 50ghz
- Signal integrity
- SI/PI principles
- Package-level design
- Bachelor's degree
- Master's degree
- Electrical Engineering
- Preferred
- Power delivery designs
- High-speed signal routing
- Optimize CoWoS
- DRC
- Design documentation
- Loss
These tags are our reading of the posting. They can miss something; the original posting is the reference.